Gigabyte Server H261-3C0 2U 4 Nodes Xeon LGA3647 C621 12×3.5″ SAS-SATA hot-swappable Brown Box

Description

• 2U – 4 nodes with rear access to the node trays

• 2nd Gen. Intel® Xeon® Scalable and Intel® Xeon® Scalable Processors

• 8 x LGA 3647 sockets

• Intel® C621 Express Chipset

• 6-Channel RDIMM/LRDIMM DDR4, 64 x DIMMs

• Supports Intel® Optane™ DC Persistent Memory

• 8 x 10Gb/s BASE-T LAN ports (Intel® X550-AT2)

• 4 x Dedicated management ports

• 1 x CMC global management port

• 12 x 3.5″ SAS/SATA hot-swappable HDD/SSD bays

• 8 x Low profile PCIe Gen3 expansion slots

• 4 x OCP Gen3 x16 mezzanine slots

• Aspeed® AST2500 remote management controller

• 2200W 80 PLUS Platinum redundant PSU

• Optimized performance with Mellanox Infiniband EDR 100G or Ethernet 100G products

2nd Generation Intel® Xeon® Scalable Family Ready

GIGABYTE’s servers are fully ready to support the second generation of Intel® Xeon® Scalable Family processors, codenamed “Cascade Lake”, which bring the following major enhancements:

• Intel® Optane™ DC Persistent Memory: Built-in support for this revolutionary new product based on Intel’s 3D Xpoint technology

• Overall Performance: Higher CPU frequencies, improved turbo profiles vs. prior-gen Intel Xeon Scalable processors

• Increased DDR4 Memory Speed & Capacity: Up to 2933MHz (1 DIMM per channel on some SKUs), 16Gb based DIMM supported

• Intel Deep Learning Boost: Significantly accelerates inference performance for deep learning workloads optimized to use VNNI (Vector Neural Network Instructions)

• Security: Hardware mitigations for Meltdown / Spectre security vulnerabilities
Dimensions
2U 4 Nodes – Rear access
Motherboard
MH61-HD3
CPU
2nd Generation Intel Xeon Scalable and Intel Xeon Scalable Processors
Intel Xeon Platinum Processor, Intel Xeon Gold Processor, Intel Xeon Silver Processor and Intel Xeon Bronze Processor
CPU TDP up to 165W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
Per Node:
2 x LGA 3647
Total:
8 x LGA 3647
Socket P
Chipset
Intel C621 Express Chipset
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel Optane^TM DC Persistent Memory (DCPMM)
1.2V modules: 2933( 1DPC)/2666/2400/2133 MHz
Maximum verified DCPMM configuration:
– Ambient temperature 35^oC
– 2nd Generation Intel Xeon Scalable processor 165W (Max.)
– DCPMM 256GB x2 pcs (Per Node)
DCPMM installation locations:
DIMM_P1_( G1, J1)
NOTE:
1. 2933MHz for 2nd Generation Intel Xeon Scalable Processors only
2. Intel Optane^TM DC Persistent Memory for 2nd Generation Intel Xeon Scalable Processors only
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35^oC
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative
LAN
Per node:
2 x 10Gb/s BASE-T LAN ports (Intel X550-AT2)
1 x Dedicated management port
Total:
8 x 10Gb/s BASE-T LAN ports (Intel X550-AT2)
4 x Dedicated management ports
1 x 10/100/1000 CMC global management port
-CMC: Chassis Management Controller, to monitor all status of computing nodes
Omni-Path is supported in option
Video
Integrated in Aspeed AST2500
2D Video Graphic Adapter with PCIe bus interface
1920×1200 at 60Hz 32bpp, DDR4 SDRAM
Management chip in CMC board:
Integrated in Aspeed AST1250
Audio
–
Storage
Per node:
3 x 3.5″ SATA/SAS hot-swappable HDD/SSD bays
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)
Total:
12 x 3.5″ SATA/SAS hot-swappable HDD/SSD bays
2.5″ HDD/SSD supported
SAS card is required for SAS devices support
RAID
Intel SATA RAID 0/1/5
Peripheral Drives
–
Expansion Slots
Per node:
1 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus)
1 x Half-length low-profile slot with PCIe x8 (Gen3 x8 bus)
1 x OCP mezzanine slot with PCIe Gen3 x16 bus
Total:
4 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus)
4 x Half-length low-profile slot with PCIe x8 (Gen3 x8 bus)
4 x OCP mezzanine slot with PCIe Gen3 x16 bus
Internal I/O
Per node:
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
1 x CMC status LED
-Only one CMC status LED per system
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x RJ45 MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x RJ45 MLAN
4 x ID LEDs
1 x CMC global management port
-Only one CMC global management port per system
Backplane I/O
12 x ports
12Gb/s and 6Gb/s compatible
TPM
1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000
Power Supply
2 x 2200W redundant PSUs
80 PLUS Platinum
AC Input:
– 100-127V and more/ 14A, 47-63Hz
– 200-240V and more / 12.6A, 47-63Hz
DC Output:
– Max 1200W/ 100-127V and more
+12.12V/ 95.6A
+12Vsb/ 3.5A
– Max 2200W/ 200-240V
+12.12V/ 178.1A
+12Vsb/ 3.5A